CN
EN
Home
Product | Application
Product
Ceramic package discrete tube amplifier
Plastic package discrete amplifier
Integrated multi-chip module
H-series Bare Die
J-series Bare Die
Application
Wireless telecom
RF energy
Multi-purpose market
Support
Support
Document Center
Online support
Marketing management
Distributor
Join us
Join us
Talent Policy
Social Recruitment
Campus Recruitment
Training Development
Dynax Life
About Dynax
About Dynax
Company
Sustainable Development
Investors
Projects & Cooperation
Awards
News
Contact us
Support
Document Center
Online support
Marketing management
Distributor
Join us
Talent Policy
Social Recruitment
Campus Recruitment
Training Development
Dynax Life
Product | Application
Product
Application
About Dynax
Company
Sustainable Development
Investors
Projects & Cooperation
Awards
News
Contact us
Chinese
English
© 2020 Dynax Semiconductor. All Rights Reserved.
Product
Ceramic package discrete tube amplifier
Plastic package discrete amplifier
Integrated multi-chip module
H-series Bare Die
J-series Bare Die
Others
Ceramic package discrete tube amplifier
Plastic package discrete amplifier
Integrated multi-chip module
H-series Bare Die
J-series Bare Die
Others
Part Number
Package
Band(MHz)
Ppeak(W)
Pout(dBm)
Eff@Pout(%)
Power Gain(dB)
Status
Download
共
0
页
0
条
CN
